MYC-YT113X CPU Module
MYC-YT113X
Measuring only 37mm by 39mm, the MYC-YT113X is a low-cost embedded ARM SoM based on Allwinner T113-S3 processor which features up to 1.2GHz Dual-core ARM Cortex-A7 MPU with built-in 128MB DDR3, single-core HiFi4 DSP, Robust Video Engine and a broad range of peripherals like Gigabit Ethernet, 2 x CAN, 2 x USB2.0, 6 x UART, etc. The MYC-YT113X takes full features of the T113-S3 processor and has standard configurations for 256MB Nand Flash or 4GB eMMC external memory options. A number of peripheral and IO signals are access through 1.0mm pitch 140-pin stamp-hole (Castellated-Hole) expansion interface. It is capable of running Linux and suitable for applications such as HMI, industrial automation, display and control terminals.
MYC-YT113X (delivered with shielding cover by default)
- Up to 1.2GHz Allwinner T113-S3 Dual-core ARM Cortex-A7 MPU with 128MB DDR3 and Single-core HiFi4 DSP
- 4GB eMMC/256MB Nand Flash, 32KB EEPROM
- 1.0mm pitch 140-pin Stamp Hole Expansion Interface
- Supports Running Linux 5.4 OS
MYIR provides MYD-YT113X Development Board for evaluating the MYC-YT113X. It takes full advantages of the Allwinner T113-S3 MPU to explore a rich set of peripherals and interfaces to the base board including serial ports, one Gigabit Ethernet, two USB 2.0 HOST and one USB 2.0 OTG, one Micro SD card slot, one M.2 Socket for USB based 4G/5G LTE Module with two SIM card holders, one USB2.0 based WiFi module, one GPIO/I2C/UART/SPI/CAN extension header, Audio input/output and LVDS display interface.
MYD-YT113X Development Board Top-view
MYD-YT113X Development Board Bottom-view
MYIR also offers MY-WIREDCOM RPI Module (RS232/RS485/CAN) and MY-LVDS070C LCD Module as options for the MYD-YT113X Development Board to enhance the functionality of the board.
Features
Mechanical Parameters
- Dimensions: 37mm x 39mm
- PCB Layers: 6-layer design
- Power supply: 5V/1A
- Working temperature: -40~85 Celsius (industrial grade)
Processor
- Allwinner T113-S3 processor
- Up to 1.2GHz Dual-core Arm Cortex-A7 with built-in 128MB DDR3
- Single-core HiFi4 DSP
- Supports H.265/H.264 video decoding up to 1080p@60fps and JPEG/MJPEG video encoding up to 1080p@60fps
Memory
- 4GB eMMC or 256MB Nand FLASH
- 32KB EEPROM
Peripherals and Signals Routed to Pins
- 1.0mm pitch 140-pin stamp hole expansion interface
- 1 x RGMII/RMII
- 2 x USB2.0
- 6 x UART
- 2 x CAN
- 4 x TWI
- 2 x SPI
- 1 x GPADC and 4 x TPADC
- 1 x MIPI DSI
- 2 x LVDS
- 1 x RGB
- 1 x CVBS Out (TV Out)
- 1 x Parallel CSI
- 2 x CVBS In (TV In)
- 2 x I2S
- Up to 59 GPIOs
OS Support
- Linux 5.4
Packing List
| Item | Part No. | Included |
|---|---|---|
|
MYC-YT113X |
MYC-YT113S3-256N128D-110-I |
One MYC-YT113X Module |
|
MYC-YT113S3-4E128D-110-I |
||
|
MYD-YT113S3-256N128D-110-I |
-One MYD-YT113X board (including MYC-YT113X CPU Module) |
|
|
MYD-YT113S3-4E128D-110-I |
||
| MY-WIREDCOM RPI Module |
MY-WIREDCOM |
RPI Mofule for extension of RS232/RS485/CAN |
| MY-LVDS070C | 7-inch LCD Module with capacitive touch screen |
Hardware Specification
The MYC-YT113X is using 14 x 14mm, eLQFP128 package Allwinner T113-S3 processor which is designed for the automotive and industrial control products. It integrates dual-core Cortex-A7 CPU and single-core HiFi4 DSP to provide the high efficient computing power. T113-S3 supports full format decoding such as H.265, H.264, MPEG-1/2/4, JPEG, VC1, and so on. The independent hardware encoder can encode in JPEG or MJPEG. Integrated multi ADCs/DACs and I2S/PCM/DMIC/OWA audio interfaces can provide the perfect voice interaction solution. T113-S3 comes with extensive connectivity to facilitate product expansion, such as CAN, USB, SDIO, EMAC, TWI, UART, SPI, PWM, GPADC, IR TX&RX, and so on.
| Features | Description |
|---|---|
| CPU |
|
| DSP |
|
| Memory |
|
| Video Engine |
Video decoding
Video encoding
|
| Display Engine |
|
| Video OUT |
|
| Video IN |
|
| Audio |
|
| Security System |
|
| Connectivity |
|
| Package | eOFP128, 14 mm x 14 mm |
Dimensions of MYC-YT113X
Software Features
The MYC-YT113X supports Linux OS and comes with complete software package. The kernel and many peripheral drivers are available in source code to assist clients to expedite their development. The following are a summary of the software features:
| Item | Features | Description | Features |
|---|---|---|---|
| Bootloader | U-boot | Boot boot program uboot_2018.05 | YES |
| Linux kernel | Linux kernel | Customized base on official kernel_5.4.61 version | YES |
| Device driver | USB Host | USB Host driver | YES |
| USB OTG | USB OTG driver | YES | |
| I2C | I2C bus driver | YES | |
| SPI | SPI bus driver | YES | |
| Ethernet | YT8531SH driver | YES | |
| SDHI | EMMC/SD card storage driver | YES | |
| LVDS | LCD driver | YES | |
| Touch | Touch screen driver | YES | |
| Audio | SPDIF driver | YES | |
| Watchdog | Watchdog driver | YES | |
| 4G/5G | 4G/5G driver | YES | |
| PWM | PWM control driver | YES | |
| ADC | ADC driver | YES | |
| RTC | RTC driver | YES | |
| GPIO | Universal GPIO driver | YES | |
| UART | RS232/RS485/TTL driver | YES | |
| CAN | CAN driver | YES | |
| WIFI | RTL8731BU driver | YES | |
| File System | t113_linux_myir_emmc_core | Image built with Buildroot, excluding GUI interface | YES |
| t113_linux_myir_emmc_full | A fully functional image built with Buildroot | YES | |
| t113_linux_myir_nand | Image built with Buildroot, excluding GUI interface, used for Nand Flash version | YES |
